Core specifications
10M25DAF256C8G is manufactured based on 55nm low-power process and is the main model in the MAX 10 series for cost-sensitive mid-range applications.MAX 10 devices areSingle chip, non-volatileProgrammable logic devices integrate SRAM configuration memory and dual configuration flash memory on the same chip, simplifying system design.Highlights of the MAX 10 devices include dual configuration flash memory for internal storage, user flash memory, instant-on support, integrated analog-to-digital converters, and single-chip Nios II soft-core processor support.
Logic and calculation: Chip contains1,563 logic array blocksand25,000 logic cells, compared to other 4K or 8K logic unit models in the MAX 10 series, this chip can handle complex logic processing and protocol conversion tasks.In terms of embedded storage, the device integrates691,200 bits (approximately 675Kbits) of block RAM。
In terms of interface and packaging, the chip provides178 user-programmable I/O pins, the package adopts 256-FBGA (17×17mm), surface mount, solder ball spacing 1mm.I/O supports multiple level standards, making it easy to connect various sensors and communication buses, with a maximum clock frequency of up to402MHz.This model complies with RoHS environmental standards and covers operating temperatures0℃ to 85℃ (commercial grade), core supply voltage1.15V to 1.25V。
Model naming analysis
The model name of 10M25DAF256C8G carries complete specification information:10MRepresents MAX 10 series;25Represents approximately 25K logic units;DAFThe D in it represents the product grade and packaging type, A represents the A-class device option, and F represents the FBGA package;256Represents 256-pin package;C8Represents commercial grade operating temperature (0℃ to 85℃) and medium speed grade;GIt is marked as lead-free, environmentally friendly and RoHS compliant.
Core advantages: Non-volatile + instant start to release design flexibility
The core value of 10M25DAF256C8G in product design is concentrated in the combination of non-volatility, instant start-up and high integration.Traditional SRAM-based FPGAs need to load the configuration from an external ROM when powered on, which can take hundreds of milliseconds and occupy PCB area. However, MAX 10 devices embed the configuration flash memory inside the chip and can run in microseconds after powering on.Dual configuration flashTwo sets of firmware are stored in the chip, and golden image safe rollback is supported during remote upgrade to avoid device bricking due to upgrade failure.User flash memoryProvides additional on-chip non-volatile storage space, which can be used to store key data such as device ID, calibration parameters, etc., without the need for external EEPROM.
The chip integrates12 analog-to-digital converters (ADCs)Channel and multi-channel hardware temperature sensors can effectively reduce off-chip ADC and corresponding PCB layout resources in scenarios such as power management and industrial site voltage/current monitoring, and directly perform mixed processing of analog and digital quantities through FPGA, significantly reducing the BOM cost of the solution.
Dual configuration flashThis is an important differentiating feature that distinguishes the MAX 10 series from other logic devices.It is used to avoid permanent bricking of the system due to unexpected power outages during FPGA logic updates, making the risk of remote on-site upgrade of equipment close to zero.cooperateSingle-chip Nios II soft-core processorWith integrated support, system designers can complete protocol processing, system monitoring and other functions without adding external processors, further improving the ease of collaborative development of software and hardware.
Typical application scenarios
The coverage of 10M25DAF256C8G is quite wide, and it is especially suitable for application scenarios that require non-volatile storage and mid-range logic resources.
Industrial Automation and ControlIt is one of its core application directions.MAX 10 FPGA is suitable for industrial IoT, embedded vision and computing, providing an ideal solution for system management, I/O expansion and communication control.In PLC controllers, machine vision systems, and multi-axis motion control, engineers use FPGA parallel processing capabilities to achieve high-speed pulse counting, PWM signal generation, and multi-channel sensor data collection, while flexibly connecting various peripherals through 178 I/Os.The integrated ADC can directly collect on-site voltage/current signals without the need for additional A/D chips, helping to simplify design and reduce costs.
Automotive Electronics and Vehicle SystemsIn terms of performance, MAX 10 FPGA is used in advanced driver assistance systems for real-time processing functions such as lane departure warning and automatic emergency braking. Its non-volatile architecture ensures that the system has extremely high startup robustness in harsh temperature and vibration environments.Industrial-grade or automotive-grade models that can work at -40°C to 125°C will be deployed in ECUs, gateways, and vehicle infotainment systems for a long time for multiple tasks such as logic control, interface expansion, and safety monitoring.
Communications infrastructure and network equipment, used for communication control plane and I/O expansion, supporting custom logic acceleration of standard serial interfaces such as SPI, I2C and other protocols.In routers, switches, base station controllers and access network equipment, FPGAs can perform high-speed parsing of data packets, protocol bridging and clock data recovery.The integrated ADC can monitor power rail and line status, helping the system predict failure risks in real time.
Medical electronics and consumer terminalsAlso relying on this chip, its cost-effectiveness and short development cycle enable it to flexibly implement customized functions such as algorithm acceleration, sensor fusion, and human-machine interface control in products such as patient monitors, portable ultrasound, IoT gateways, and smart display terminals.It fully complies with environmental protection standards such as RoHS and is easy to pass health and safety certifications in relevant industries.
Related models and alternative references
10M25DAF256C8G is positioned at the upper-middle level of logic scale in the MAX 10 series. The same series provides a wealth of temperature grades, packaging forms and logic capacity branches for project selection.
Selection of different temperature levels in the same series: If you need to extend the operating temperature to-40℃ to 125℃ (industrial grade), optional10M25DCF256A7G.If you need to upgrade or downgrade the model within the same package, you can choose a larger logic unit model of the same series.10M50DAF256C8G(50K logic units), the package size and pin definition are exactly the same, which is beneficial to the performance expansion or cost reduction of the project.If the PCB area is tight, 10M25 can be reduced to a small size package, choose10M25SCE144A7G(144-EQFP package, 101 I/Os), complies with -40°C to 125°C extended industry standards, and has undergone AEC-Q100 reliable certification in more compact board-level designs.Among similar package options, 10M25DAF484C8G provides a 484-FBGA package (23×23mm) with up to 360 I/Os, which is suitable for complex designs that require a large number of peripheral expansions.If the speed margin requirement is not high and costs need to be reduced, you can choose a lower speed grade10M25DAF256C6/C7, the logic scale and packaging are exactly the same, suitable for consumer devices with loose timing requirements.
Cross-brand equivalent alternative reference: At the same logic density level and package size, you can choose the Xilinx Artix-7 seriesXC7A50T-1FTG256I(approximately 52K logic units), but there are differences between the two in power supply voltage, temperature range and development tool chain. When replacing, you need to focus on checking packaging compatibility and logic resource utilization.In terms of localized replacement, some manufacturers have already launched FPGA solutions that are compatible with MAX 10 series pin functions. However, replacement requires detailed timing simulation and hardware verification, and complete firmware transplantation.
write at the end
As a non-volatile mid-range FPGA with approximately 25K logic units in the Intel (formerly Altera) MAX 10 series, 10M25DAF256C8G integrates 25,000 logic units, 178 I/O pins, 12-channel integrated ADC and other resources into a 17×17mm FBGA-256 compact package. It not only takes into account performance and cost, but also provides a solid foundation for the safety and reliability of industrial and automotive sites.
As a chip agent distributor that has been deeply involved in the electronic components industry since 2011, Shenzhen Hongmai Electronics Co., Ltd. has long-term stock of Intel (formerly Altera) MAXThe original 10 series FPGA is in stock, including 10M25DAF256C8G and 10M25DCU256A7G, 10M25DCF256I7G, 10M50DAF256C8G and other compatible models. It also supplies FPGA configuration chips, power management, storage and other peripheral components, and supports factory batch direct shipment, small batch samples and technical selection assistance.If you need to inquire about prices or need to know the selection suggestions of different packages and speed levels of the same series, please feel free to contact us at any time (tel: 0755-23815611, QQ 2355878270).Shenzhen Hongmai Electronics Co., Ltd.
